The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2020
Filed:
Mar. 25, 2014
Applicant:
Dai Nippon Printing Co., Ltd., Tokyo, JP;
Inventors:
Chigusa Kuriyama, Tokyo, JP;
Toshifumi Fujii, Tokyo, JP;
Assignee:
Dai Nippon Printing Co., Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/08 (2006.01); B32B 15/08 (2006.01); B32B 27/32 (2006.01); B32B 27/36 (2006.01); B32B 27/40 (2006.01); B29C 45/14 (2006.01); B32B 15/20 (2006.01); B32B 7/12 (2006.01); B32B 27/30 (2006.01); B32B 15/082 (2006.01); B32B 15/09 (2006.01); B32B 15/095 (2006.01); B32B 15/085 (2006.01); B32B 7/02 (2019.01); B32B 27/28 (2006.01);
U.S. Cl.
CPC ...
B32B 27/08 (2013.01); B29C 45/14688 (2013.01); B32B 7/02 (2013.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 15/082 (2013.01); B32B 15/085 (2013.01); B32B 15/09 (2013.01); B32B 15/095 (2013.01); B32B 15/20 (2013.01); B32B 27/283 (2013.01); B32B 27/30 (2013.01); B32B 27/306 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B32B 27/36 (2013.01); B32B 27/40 (2013.01); B32B 2307/402 (2013.01); B32B 2307/4026 (2013.01); B32B 2307/412 (2013.01); B32B 2307/518 (2013.01); B32B 2307/538 (2013.01); B32B 2307/748 (2013.01); B32B 2451/00 (2013.01);
Abstract
The present invention provides a decorative sheet provided with three-dimensional moldability capable of sufficiently following the shape of a decorative resin molded article having a complicated surface shape. There is provided a decorative sheet composed of a layered body in which at least a substrate layer, a primer layer, and a thin metal film layer have been layered in sequence, and the primer layer contains a cured material having a resin in which the glass transition point is −30° C. to 80° C.