The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2020
Filed:
Nov. 18, 2010
Encai Hao, Woodbury, MN (US);
Audrey A. Sherman, St. Paul, MN (US);
Kevin R. Schaffer, Woodbury, MN (US);
Daniel W. Hennen, Cottage Grove, MN (US);
John P. Baetzold, North St. Paul, MN (US);
Mark J. Pellerite, Woodbury, MN (US);
Mikhail L. Pekurovsky, Bloomington, MN (US);
Kanta Kumar, Woodbury, MN (US);
Michael L. Steiner, New Richmond, WI (US);
John J. Stradinger, Roseville, MN (US);
Encai Hao, Woodbury, MN (US);
Audrey A. Sherman, St. Paul, MN (US);
Kevin R. Schaffer, Woodbury, MN (US);
Daniel W. Hennen, Cottage Grove, MN (US);
John P. Baetzold, North St. Paul, MN (US);
Mark J. Pellerite, Woodbury, MN (US);
Mikhail L. Pekurovsky, Bloomington, MN (US);
Kanta Kumar, Woodbury, MN (US);
Michael L. Steiner, New Richmond, WI (US);
John J. Stradinger, Roseville, MN (US);
3M INNOVATIVE PROPERTIES COMPANY, St. Paul, MN (US);
Abstract
Surface-modified adhesives may be prepared by contacting an adhesive layer to an at least partially discontinuous layer on a releasing substrate and removing the adhesive layer such that at least a portion of the at least partially discontinuous layer adheres to the adhesive surface. The modified adhesive surface remains an adhesive surface. The modified adhesive layer can be used to prepare adhesive articles, including articles containing multiple surface-modified adhesive layers.