The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2020

Filed:

Nov. 18, 2010
Applicants:

Encai Hao, Woodbury, MN (US);

Audrey A. Sherman, St. Paul, MN (US);

Kevin R. Schaffer, Woodbury, MN (US);

Daniel W. Hennen, Cottage Grove, MN (US);

John P. Baetzold, North St. Paul, MN (US);

Mark J. Pellerite, Woodbury, MN (US);

Mikhail L. Pekurovsky, Bloomington, MN (US);

Kanta Kumar, Woodbury, MN (US);

Michael L. Steiner, New Richmond, WI (US);

John J. Stradinger, Roseville, MN (US);

Inventors:

Encai Hao, Woodbury, MN (US);

Audrey A. Sherman, St. Paul, MN (US);

Kevin R. Schaffer, Woodbury, MN (US);

Daniel W. Hennen, Cottage Grove, MN (US);

John P. Baetzold, North St. Paul, MN (US);

Mark J. Pellerite, Woodbury, MN (US);

Mikhail L. Pekurovsky, Bloomington, MN (US);

Kanta Kumar, Woodbury, MN (US);

Michael L. Steiner, New Richmond, WI (US);

John J. Stradinger, Roseville, MN (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/00 (2018.01); B32B 37/30 (2006.01); B05D 5/12 (2006.01); B05D 5/10 (2006.01); B32B 7/12 (2006.01); B05D 5/00 (2006.01); B82Y 30/00 (2011.01); B32B 7/10 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 15/02 (2006.01); B32B 7/06 (2019.01); B32B 29/00 (2006.01); C09J 7/40 (2018.01); B32B 3/08 (2006.01); C09J 7/10 (2018.01);
U.S. Cl.
CPC ...
B32B 7/10 (2013.01); B32B 3/085 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 15/02 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B32B 29/00 (2013.01); C09J 7/10 (2018.01); C09J 7/40 (2018.01); B32B 2264/102 (2013.01); B32B 2264/105 (2013.01); B32B 2264/108 (2013.01); B32B 2307/202 (2013.01); B32B 2307/21 (2013.01); B32B 2307/40 (2013.01); B32B 2307/418 (2013.01); B32B 2307/704 (2013.01); B32B 2307/732 (2013.01); C09J 2201/28 (2013.01); C09J 2201/606 (2013.01); C09J 2203/334 (2013.01); Y10T 428/24851 (2015.01); Y10T 428/24893 (2015.01); Y10T 442/10 (2015.04);
Abstract

Surface-modified adhesives may be prepared by contacting an adhesive layer to an at least partially discontinuous layer on a releasing substrate and removing the adhesive layer such that at least a portion of the at least partially discontinuous layer adheres to the adhesive surface. The modified adhesive surface remains an adhesive surface. The modified adhesive layer can be used to prepare adhesive articles, including articles containing multiple surface-modified adhesive layers.


Find Patent Forward Citations

Loading…