The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2020
Filed:
Apr. 15, 2016
Tanazawa Hakkosha Co., Ltd., Higashiosaka-shi, Osaka, JP;
Masayuki Sakai, Higashiosaka, JP;
Hisao Aota, Higashiosaka, JP;
TANAZAWA HAKKOSHA CO., LTD., Higashiosaka-Shi, Osaka, JP;
Abstract
A resin molding mold in accordance with the present application is a resin molding mold for molding a resin molded product. The resin molding mold includes a molding mold and a mirror-surface coat layer formed on a mold surface of the molding mold. The mirror-surface coat layer is formed by a thermosetting resin having a thermal conductivity in a range from 0.10 W/(mK) or more to 0.99 W/(mK) or less. The thickness of the mirror-surface coat layer is set in a range from 1.0 μm or more to 30 μm or less, and is preferably set to 20 μm or less. The surface of the mirror-surface coat layer is provided with a flat-surface maintaining part formed into a substantially flat surface.