The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2020

Filed:

Jul. 15, 2019
Applicant:

Align Technology, Inc., San Jose, CA (US);

Inventor:

James C. Culp, Pleasanton, CA (US);

Assignee:

Align Technology, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/06 (2014.01); B23K 26/142 (2014.01); B23K 26/08 (2014.01); A61C 13/00 (2006.01); B23K 26/38 (2014.01); B23K 26/064 (2014.01); A61C 7/08 (2006.01);
U.S. Cl.
CPC ...
B23K 26/0626 (2013.01); A61C 13/0006 (2013.01); B23K 26/064 (2015.10); B23K 26/08 (2013.01); B23K 26/083 (2013.01); B23K 26/0853 (2013.01); B23K 26/0861 (2013.01); B23K 26/142 (2015.10); B23K 26/38 (2013.01); A61C 7/08 (2013.01);
Abstract

Laser cutting systems and methods are described herein. One or more systems include a laser generating component, an optical component, a fixture for holding a support with a part positioned on the support, and a control mechanism for adjusting at least one of the laser generating component, the optical component, and the fixture such that a ratio of a laser energy applied to the part and a part material thickness is maintained within a predetermined acceptable range at each point along a cut path to cut through the part while maintaining the integrity of the support. Other systems and methods are disclosed herein.


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