The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2020

Filed:

Jan. 24, 2017
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Masaya Ishida, Hara-mura, JP;

Tomoyuki Kamakura, Matsumoto, JP;

Eiji Okamoto, Matsumoto, JP;

Takeshi Miyashita, Suwa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 7/00 (2006.01); B33Y 80/00 (2015.01); B33Y 70/00 (2020.01); B29C 67/00 (2017.01); B22F 5/00 (2006.01); B23K 26/342 (2014.01); B28B 1/00 (2006.01); B33Y 10/00 (2015.01); B22F 3/105 (2006.01); B22F 5/12 (2006.01); B22F 3/00 (2006.01); H05K 3/12 (2006.01); B29C 64/165 (2017.01); B29C 64/153 (2017.01); H05K 3/28 (2006.01); B29K 105/16 (2006.01); B29K 505/00 (2006.01); B29K 509/02 (2006.01); H01L 23/34 (2006.01); H01L 49/02 (2006.01); H01L 29/861 (2006.01); H01L 29/70 (2006.01); B23K 101/40 (2006.01); B23K 103/16 (2006.01); H05K 1/16 (2006.01); B41J 3/407 (2006.01);
U.S. Cl.
CPC ...
B22F 7/008 (2013.01); B22F 3/008 (2013.01); B22F 3/1055 (2013.01); B22F 5/00 (2013.01); B22F 5/12 (2013.01); B23K 26/342 (2015.10); B28B 1/001 (2013.01); B29C 64/153 (2017.08); B29C 64/165 (2017.08); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); H05K 3/1275 (2013.01); H05K 3/28 (2013.01); B22F 2003/1058 (2013.01); B22F 2998/10 (2013.01); B23K 2101/40 (2018.08); B23K 2103/16 (2018.08); B29K 2105/16 (2013.01); B29K 2505/00 (2013.01); B29K 2509/02 (2013.01); B41J 3/4073 (2013.01); H01L 23/345 (2013.01); H01L 28/10 (2013.01); H01L 28/20 (2013.01); H01L 28/40 (2013.01); H01L 29/70 (2013.01); H01L 29/861 (2013.01); H05K 1/162 (2013.01); H05K 1/165 (2013.01); H05K 1/167 (2013.01); Y02P 10/295 (2015.11);
Abstract

A three-dimensional production method for a functional element structure body according to the invention is a three-dimensional production method for a functional element structure body, which includes an electrical functional element section having a terminal and an insulating member provided on the periphery of the functional element section in a state where at least the terminal is exposed to the outside, and includes a layer formation step of forming one layer in a layer forming region by supplying a first flowable composition containing first particles for the functional element section from a first supply section, and supplying a second flowable composition containing second particles for the insulating member from a second supply section, a shaping step of shaping the functional element structure body by repeating the layer formation step, and a solidification step of performing solidification by applying energy to the first particles and the second particles in the layer.


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