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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10773207 B1

PDFFull Text
Date of Patent:
Sep. 15, 2020

Filed:

Mar. 28, 2018

Conductive honeycomb structure

Applicant:

Ngk Insulators, Ltd., Nagoya-Shi, JP;

Inventor:

Takashi Noro, Nagoya, JP;

Assignee:

NGK Insulators, Ltd., Nagoya-Shi, JP;

Attorney:

Burr & Brown, PLLC

Primary Examiner:

Humera N Sheikh

Assistant Examiner:

Mary I Omori

Int. Cl.
CPC ...
B01D 53/86 (2006.01); B01J 35/04 (2006.01); B01J 37/08 (2006.01); B23K 35/02 (2006.01); C04B 38/00 (2006.01); B23K 1/00 (2006.01); C04B 37/02 (2006.01); C04B 41/89 (2006.01); C04B 35/63 (2006.01); C04B 41/52 (2006.01); F01N 3/20 (2006.01); C04B 35/626 (2006.01); C04B 41/00 (2006.01); C04B 35/58 (2006.01); C04B 35/565 (2006.01); F01N 3/28 (2006.01); B23K 26/21 (2014.01); C04B 111/00 (2006.01); C04B 111/94 (2006.01); B23K 101/38 (2006.01);
U.S. Cl.
CPC ...
B01D 53/86 (2013.01); B01J 35/04 (2013.01); B01J 37/08 (2013.01); B23K 1/0014 (2013.01); B23K 26/21 (2015.10); B23K 35/02 (2013.01); B23K 35/0244 (2013.01); C04B 35/565 (2013.01); C04B 35/58092 (2013.01); C04B 35/6263 (2013.01); C04B 35/6316 (2013.01); C04B 37/02 (2013.01); C04B 37/025 (2013.01); C04B 38/0009 (2013.01); C04B 38/0012 (2013.01); C04B 41/009 (2013.01); C04B 41/52 (2013.01); C04B 41/89 (2013.01); F01N 3/2013 (2013.01); F01N 3/2828 (2013.01); B23K 2101/38 (2018.08); C04B 2111/0081 (2013.01); C04B 2111/94 (2013.01); C04B 2235/3826 (2013.01); C04B 2235/3891 (2013.01); C04B 2235/428 (2013.01); C04B 2235/5436 (2013.01); C04B 2235/665 (2013.01); C04B 2235/96 (2013.01); C04B 2235/9607 (2013.01); C04B 2237/08 (2013.01); C04B 2237/365 (2013.01); C04B 2237/406 (2013.01); C04B 2237/706 (2013.01); C04B 2237/708 (2013.01);
Abstract

A conductive honeycomb structure, comprising: a columnar ceramic honeycomb structure portion comprising an outer peripheral side wall and partition walls each disposed inside the outer peripheral side wall and defining a plurality of cells penetrating from one bottom surface to another bottom surface to form flow paths; a pair of electrode layers disposed on an outer surface of the outer peripheral side wall across a central axis of the honeycomb structure portion; and a pair of metal terminals joined to the respective electrode layers via one or more welded portions, wherein each of the one or more welded portions comprises a welded area of from 2 to 50 mm.

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