The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2020

Filed:

Mar. 29, 2017
Applicant:

Commscope Technologies Llc, Hickory, NC (US);

Inventor:

Kevin Craig, Dudley, MA (US);

Assignee:

CommScope Technologies LLC, Hickory, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 9/00 (2006.01); H01L 23/367 (2006.01); H01L 23/42 (2006.01); H01L 23/433 (2006.01); H05K 1/02 (2006.01); H01L 21/48 (2006.01); H01L 21/52 (2006.01); H01L 23/40 (2006.01); H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 23/053 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0032 (2013.01); H01L 21/4882 (2013.01); H01L 21/52 (2013.01); H01L 23/3675 (2013.01); H01L 23/4006 (2013.01); H01L 23/42 (2013.01); H01L 23/433 (2013.01); H01L 23/552 (2013.01); H01L 24/32 (2013.01); H05K 1/021 (2013.01); H05K 1/0216 (2013.01); H05K 7/20409 (2013.01); H05K 7/20445 (2013.01); H01L 23/053 (2013.01); H01L 2023/405 (2013.01); H01L 2023/4031 (2013.01); H01L 2023/4087 (2013.01); H01L 2224/32245 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/3025 (2013.01); H05K 1/0203 (2013.01); H05K 1/181 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10265 (2013.01); H05K 2201/10371 (2013.01); H05K 2201/10409 (2013.01); H05K 2201/10522 (2013.01); H05K 2201/10674 (2013.01); H05K 2201/10734 (2013.01);
Abstract

Systems and methods for thermal management for high power density EMI shielded electronic devices. In one embodiment, an electronic module comprises: a circuit board; at least one integrated circuit mounted to the circuit board; at least one electro-magnetic interference (EMI) shield fence mounted to the circuit board, wherein the at least one integrated circuit is mounted within a perimeter defined by the EMI shield fence; a heatsink EMI shield lid secured onto the at least one EMI shield fence, wherein the heatsink EMI shield lid seals the at least one integrated circuit within the at least one EMI shield fence; wherein the heatsink EMI shield lid comprises a spring loaded thermal interface in conductive thermal contact with the at least one integrated circuit.


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