The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2020

Filed:

Aug. 23, 2018
Applicant:

Sf Motors, Inc., Santa Clara, CA (US);

Inventors:

Yunan Song, Santa Clara, CA (US);

Kangwei Mao, Santa Clara, CA (US);

Jinzhu Li, Santa Clara, CA (US);

Colin Haag, Santa Clara, CA (US);

Nathan Chung, Santa Clara, CA (US);

Zhong Nie, Santa Clara, CA (US);

Duanyang Wang, Santa Clara, CA (US);

Yifan Tang, Santa Clara, CA (US);

Assignees:

CHONGQING JINKANG NEW ENERGY VEHICLE CO., LTD., Chongqing, CN;

SF MOTORS, INC., Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 7/02 (2006.01); H02G 5/00 (2006.01); H02M 7/00 (2006.01); H05K 5/00 (2006.01); H05K 9/00 (2006.01); H05K 3/30 (2006.01); H02P 27/06 (2006.01); H02M 7/5387 (2007.01); B60L 15/00 (2006.01);
U.S. Cl.
CPC ...
H05K 7/209 (2013.01); B60L 15/007 (2013.01); H02M 7/003 (2013.01); H02M 7/5387 (2013.01); H02P 27/06 (2013.01); H05K 3/303 (2013.01); H05K 5/0021 (2013.01); H05K 5/0026 (2013.01); H05K 7/20854 (2013.01); H05K 7/20881 (2013.01); H05K 7/20927 (2013.01); H05K 7/20945 (2013.01); H05K 9/0007 (2013.01); B60L 2210/44 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10272 (2013.01); H05K 2201/10393 (2013.01);
Abstract

Provided herein is an inverter module to power an electric vehicle. The inverter module can include a power module or multiple power modules. The power module can include a capacitor and a heat sink coupled with the capacitor. The power module can include a ceramic plate coupled with the heat sink. The power module can include a locator having a plurality of slots and a plurality of transistors disposed within the plurality of slots. The locator and the plurality of transistors can be disposed over a first surface of the ceramic plate. The power module can include a laminated bus bar disposed over a first surface of the locator. The power module can include a gate drive printed circuit board coupled with the laminated bus bar. The power module can include a dielectric gel tray disposed over a first surface of the gate drive printed circuit board.


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