The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2020
Filed:
Jun. 26, 2019
Applicant:
Lenovo (Beijing) Co., Ltd., Beijing, CN;
Inventor:
Guowen Zhang, Beijing, CN;
Assignee:
LENOVO (BEIJING) CO., LTD., Beijing, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F28F 13/00 (2006.01); H01L 23/427 (2006.01); G06F 1/20 (2006.01); H05K 5/03 (2006.01);
U.S. Cl.
CPC ...
H05K 7/2039 (2013.01); F28F 13/00 (2013.01); G06F 1/203 (2013.01); H01L 23/4275 (2013.01); H05K 5/03 (2013.01); H05K 7/2029 (2013.01); H05K 7/2049 (2013.01); H05K 7/20454 (2013.01); F28F 2013/005 (2013.01); F28F 2255/02 (2013.01);
Abstract
A heat dissipation device for an electronic device is provided. The heat dissipation device comprises a heat conducting cover configured to be disposed on an electronic device, the heat conducting cover forming a closed cavity; and a heat absorbing material filler located within the closed cavity as defined by the heat conducting cover. With a temperature increase of the electronic device, the heat absorbing material filler is configured to deform structurally, to absorb heat generated by the electronic device.