The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2020
Filed:
May. 09, 2019
Applicant:
Alltop Electronics (Suzhou) Ltd., Suzhou, Jiangsu Province, CN;
Inventors:
Mindi Ni, Suzhou, CN;
Yichang Chen, New Taipei, TW;
Assignee:
ALLTOP ELECTRONICS (SUZHOU) LTD., Suzhou, Jiangsu Province, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 7/08 (2006.01); H05K 1/11 (2006.01); H01R 12/53 (2011.01); H01B 7/00 (2006.01); H01B 7/02 (2006.01); H01B 7/04 (2006.01); H01B 7/22 (2006.01); H01B 7/295 (2006.01); H01B 11/00 (2006.01); H01B 7/20 (2006.01); H01B 11/20 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H01B 7/0054 (2013.01); H01B 7/0208 (2013.01); H01B 7/0225 (2013.01); H01B 7/0241 (2013.01); H01B 7/04 (2013.01); H01B 7/0853 (2013.01); H01B 7/205 (2013.01); H01B 7/228 (2013.01); H01B 7/295 (2013.01); H01B 11/00 (2013.01); H01B 11/203 (2013.01); H01R 12/53 (2013.01); H01B 7/0823 (2013.01); H05K 1/117 (2013.01); H05K 2201/094 (2013.01); H05K 2201/09027 (2013.01); H05K 2201/10356 (2013.01);
Abstract
A flat data transmission cable includes a plurality of juxtaposed wires, a plastic layer enclosing on the wires integrally and a metallic layer formed by a metal material belt arranged on an outer side of the plastic layer in a spiral winding way, each wire has a conductor. The metallic layer has at least an aluminum foil layer and a bonding layer arranged on the side of the aluminum foil layer facing to the plastic layer, the metallic layer is bonded to the outer side of the plastic layer by the bonding layer.