The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2020
Filed:
May. 03, 2016
Applicant:
Keyssa Systems, Inc., Campbell, CA (US);
Inventors:
Roger D. Isaac, San Jose, CA (US);
Mostafa Naguib Abdulla, Rancho Cordova, CA (US);
Assignee:
KEYSSA SYSTEMS, INC., Campbell, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P 5/02 (2006.01); H01P 11/00 (2006.01); H04B 5/00 (2006.01); H02J 50/90 (2016.01); H01F 38/14 (2006.01); G06F 1/16 (2006.01); G06F 13/42 (2006.01); G06F 3/14 (2006.01); G06F 13/00 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); H01L 21/48 (2006.01); H01L 23/04 (2006.01); H01L 23/31 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2006.01); H04B 1/03 (2006.01); H04B 1/08 (2006.01); H05K 1/14 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0237 (2013.01); H01L 21/4817 (2013.01); H01L 23/04 (2013.01); H01L 23/3128 (2013.01); H01L 23/3135 (2013.01); H01L 23/66 (2013.01); H01L 24/17 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 25/16 (2013.01); H04B 1/03 (2013.01); H04B 1/08 (2013.01); H05K 1/0296 (2013.01); H05K 1/14 (2013.01); H05K 1/181 (2013.01); H05K 3/368 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16113 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48108 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/73257 (2013.01); H05K 2201/042 (2013.01); H05K 2201/10128 (2013.01); H05K 2203/16 (2013.01); H05K 2203/162 (2013.01);
Abstract
The present disclosure relates to extremely high frequency ('EHF') systems and methods for the use thereof, and more particularly to board-to-board connections using contactless connectors.