The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2020

Filed:

Sep. 06, 2018
Applicant:

Samsung Electronics Co., Ltd., Gyeonggi-do, KR;

Inventors:

Jiho Shin, Gyeonggi-do, KR;

Yi Yang, Gyeonggi-do, KR;

Moon-Seok Kang, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04W 88/04 (2009.01); H04W 8/18 (2009.01); H04W 4/80 (2018.01); H04W 88/06 (2009.01); H04W 8/00 (2009.01);
U.S. Cl.
CPC ...
H04W 88/04 (2013.01); H04W 4/80 (2018.02); H04W 8/18 (2013.01); H04W 8/005 (2013.01); H04W 88/06 (2013.01);
Abstract

An electronic device includes first communication module establishing communication connection, using first network; second communication module establishing communication connection, using second network; one or more security modules connected to second communication module; and one or more processors connected to first and second communication modules, wherein one or more processors are configured to receive NFC control data and transaction data for NFC service from external electronic device through first communication module, acquire an AID from transaction data for NFC service, determine security module corresponding to AID from one or more security modules, transmit NFC control data and transaction data for NFC service to security module corresponding to AID from one or more security modules through second communication module, and transmit response signal received from security module corresponding to AID from one or more security modules to external electronic device through first communication module.


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