The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2020

Filed:

Oct. 18, 2019
Applicants:

Arm Limited, Cambridge, GB;

Ecs Partners Limited, Southampton, GB;

Inventors:

Sahan Sajeewa Hiniduma Udugama Gamage, Cambridge, GB;

Benjamin James Fletcher, Burwell, GB;

Shidhartha Das, Upper Cambourne, GB;

Assignees:

Arm Limited, Cambridge, GB;

ECS Partners Limited, Southampton, GB;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04L 1/00 (2006.01); H04L 7/00 (2006.01); H04B 5/00 (2006.01);
U.S. Cl.
CPC ...
H04L 1/0014 (2013.01); H04B 5/0075 (2013.01); H04L 7/0091 (2013.01);
Abstract

A method and apparatus for transferring data maps the data to a modulation code using an encoder circuit having a configuration. A binary symbol of the data is mapped to a modulation code having a plurality of modulation digits and a modulation signal is generated based on the modulation code. A transmitter drive signal is modulated based on the modulation signal. A configuration of the encoder circuit is set based on a determined performance level. The transmitter drive signal may be used to produce an electromagnetic field by generating a positive, negative or zero electrical current in an induction coil of a first semiconductor die. A current induced by the electromagnetic field in an induction coil of a second semiconductor die is demodulated to recover the data whereby the data is transferred from the first semiconductor die to the second semiconductor die.


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