The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2020
Filed:
Aug. 16, 2018
Applicant:
Skyworks Solutions, Inc., Irvine, CA (US);
Inventors:
Peter J. Zampardi, Jr., Newbury Park, CA (US);
Hongxiao Shao, Thousand Oaks, CA (US);
Tin Myint Ko, Newbury Park, CA (US);
Matthew Thomas Ozalas, Novato, CA (US);
David Steven Ripley, Marion, IA (US);
Philip John Lehtola, Cedar Rapids, IA (US);
Assignee:
Skyworks Solutions, Inc., Irvine, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/082 (2006.01); H03F 3/213 (2006.01); H03F 3/19 (2006.01); H03F 1/02 (2006.01); H03F 3/21 (2006.01); H03F 3/195 (2006.01); H01L 23/00 (2006.01); H01L 21/768 (2006.01); H03F 3/24 (2006.01); H01L 23/552 (2006.01); H01L 29/36 (2006.01); H01L 29/66 (2006.01); H01L 29/737 (2006.01); H01L 29/812 (2006.01); H01L 29/08 (2006.01); H01L 29/205 (2006.01); H01L 21/8252 (2006.01); H01L 27/06 (2006.01); H01L 23/498 (2006.01); H01L 23/50 (2006.01); H03F 3/60 (2006.01); H01L 23/66 (2006.01); H01L 29/20 (2006.01); H01L 23/48 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 21/8249 (2006.01); H01L 21/66 (2006.01); H01L 23/31 (2006.01); H01L 23/522 (2006.01); H03F 3/187 (2006.01); H03F 3/347 (2006.01); H03F 1/56 (2006.01); H03F 3/45 (2006.01); H01L 29/8605 (2006.01); H01L 27/092 (2006.01); H01L 29/06 (2006.01); H01L 29/10 (2006.01);
U.S. Cl.
CPC ...
H03F 3/213 (2013.01); H01L 21/485 (2013.01); H01L 21/4853 (2013.01); H01L 21/4864 (2013.01); H01L 21/565 (2013.01); H01L 21/76898 (2013.01); H01L 21/78 (2013.01); H01L 21/8249 (2013.01); H01L 21/8252 (2013.01); H01L 22/14 (2013.01); H01L 23/3114 (2013.01); H01L 23/481 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/49844 (2013.01); H01L 23/49861 (2013.01); H01L 23/49866 (2013.01); H01L 23/50 (2013.01); H01L 23/522 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/85 (2013.01); H01L 24/97 (2013.01); H01L 27/0605 (2013.01); H01L 27/0623 (2013.01); H01L 29/0821 (2013.01); H01L 29/0826 (2013.01); H01L 29/20 (2013.01); H01L 29/205 (2013.01); H01L 29/36 (2013.01); H01L 29/66242 (2013.01); H01L 29/7371 (2013.01); H01L 29/812 (2013.01); H03F 1/0205 (2013.01); H03F 3/19 (2013.01); H03F 3/195 (2013.01); H03F 3/21 (2013.01); H03F 3/245 (2013.01); H03F 3/60 (2013.01); H01L 23/49894 (2013.01); H01L 24/45 (2013.01); H01L 27/092 (2013.01); H01L 29/0684 (2013.01); H01L 29/1004 (2013.01); H01L 29/66863 (2013.01); H01L 29/737 (2013.01); H01L 29/8605 (2013.01); H01L 2223/665 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6644 (2013.01); H01L 2223/6655 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05164 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48177 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/48611 (2013.01); H01L 2224/48644 (2013.01); H01L 2224/48647 (2013.01); H01L 2224/48655 (2013.01); H01L 2224/48664 (2013.01); H01L 2224/48811 (2013.01); H01L 2224/48816 (2013.01); H01L 2224/48844 (2013.01); H01L 2224/48847 (2013.01); H01L 2224/48855 (2013.01); H01L 2224/48864 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/49176 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/85207 (2013.01); H01L 2224/85411 (2013.01); H01L 2224/85416 (2013.01); H01L 2224/85444 (2013.01); H01L 2224/85455 (2013.01); H01L 2224/85464 (2013.01); H01L 2924/00011 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/12033 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13051 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/30111 (2013.01); H03F 1/565 (2013.01); H03F 3/187 (2013.01); H03F 3/347 (2013.01); H03F 3/45 (2013.01); H03F 2200/387 (2013.01); H03F 2200/451 (2013.01); H03F 2200/48 (2013.01); H03F 2200/555 (2013.01);
Abstract
One aspect of this disclosure is a power amplifier module that includes a power amplifier on a substrate and a semiconductor resistor on the substrate. The power amplifier includes a bipolar transistor having a collector, a base, and an emitter. The collector has a doping concentration of at least 3×10cmat an interface with the base. The collector also has at least a first grading in which doping concentration increases away from the base. The semiconductor resistor includes a resistive layer that that includes the same material as a layer of the bipolar transistor. Other embodiments of the module are provided along with related methods and components thereof.