The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2020
Filed:
Sep. 06, 2018
Applicant:
Nokia Technologies Oy, Espoo, FI;
Inventors:
Assignee:
Nokia Technologies Oy, Espoo, FI;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/024 (2006.01); H01L 33/64 (2010.01); H01L 25/16 (2006.01); B33Y 80/00 (2015.01);
U.S. Cl.
CPC ...
H01S 5/02469 (2013.01); B33Y 80/00 (2014.12); H01L 25/167 (2013.01); H01L 33/647 (2013.01); H01S 5/02423 (2013.01); H01S 5/02438 (2013.01);
Abstract
There is disclosed a method of manufacturing an enclosure for an integrated circuit having at least one optical component and at least one electronic component, the method comprising the steps of providing at least one thermal contact connected to at least one of the components, and forming a heat sink that is integral with the enclosure, wherein the at least one thermal contact comprises electrically and thermally conductive metal suitable for transferring heat from the at least one component to the heat sink. There is also disclosed a package comprising an enclosure and an integrated circuit.