The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2020

Filed:

Nov. 30, 2018
Applicant:

Dow Gobal Technologies Llc, Midland, MI (US);

Inventors:

Jeffrey E. Bonekamp, Midland, MI (US);

Yushan Hu, Pearland, TX (US);

Nichole E. Nickel, Midland, MI (US);

Lih-Long Chu, Midland, MI (US);

John A. Naumovitz, Midland, MI (US);

Mark G. Hofius, Midland, MI (US);

Assignee:

Dow Global Technologies LLC, Midland, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/049 (2014.01); B32B 27/32 (2006.01); B32B 27/08 (2006.01); H01L 31/18 (2006.01); B29C 41/00 (2006.01); B29C 41/26 (2006.01); B29C 41/32 (2006.01); B32B 37/18 (2006.01); C08L 53/00 (2006.01); H01L 31/048 (2014.01); B29K 23/00 (2006.01); B29L 9/00 (2006.01);
U.S. Cl.
CPC ...
H01L 31/049 (2014.12); B29C 41/003 (2013.01); B29C 41/26 (2013.01); B29C 41/32 (2013.01); B32B 27/08 (2013.01); B32B 27/32 (2013.01); B32B 37/185 (2013.01); C08L 53/00 (2013.01); H01L 31/0481 (2013.01); H01L 31/18 (2013.01); B29K 2023/06 (2013.01); B29K 2023/0625 (2013.01); B29L 2009/00 (2013.01); B32B 2270/00 (2013.01); B32B 2323/04 (2013.01); B32B 2457/12 (2013.01); C08L 2203/204 (2013.01); C08L 2205/025 (2013.01); C08L 2205/03 (2013.01); C08L 2205/035 (2013.01); C08L 2205/12 (2013.01); Y02E 10/50 (2013.01);
Abstract

Disclosed are multilayer film structures including a layer (B) that includes a crystalline block copolymer composite (CBC) or a specified block copolymer composite (BC), including i) an ethylene polymer (EP) including at least 80 mol % polymerized ethylene; ii) an alpha-olefin-based crystalline polymer (CAOP) and iii) a block copolymer including (a) an ethylene polymer block including at least 80 mol % polymerized ethylene and (b) a crystalline alpha-olefin block (CAOB); and a layer C that includes a polyolefin having at least one melting peak greater than 125 C, the top facial surface of layer C in adhering contact with the bottom facial surface of layer B. Such multilayer film structure preferably includes (A) a seal layer A having a bottom facial surface in adhering contact with the top facial surface of layer B. Such films are suited for use in electronic device (ED) modules including an electronic device such as a PV cell.


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