The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2020

Filed:

Oct. 11, 2019
Applicant:

Semiconductor Energy Laboratory Co., Ltd., Atsugi-shi, Kanagawa-ken, JP;

Inventors:

Shunpei Yamazaki, Tokyo, JP;

Jun Koyama, Kanagawa, JP;

Masahiro Takahashi, Kanagawa, JP;

Hideyuki Kishida, Kanagawa, JP;

Akiharu Miyanaga, Kanagawa, JP;

Junpei Sugao, Kanagawa, JP;

Hideki Uochi, Kanagawa, JP;

Yasuo Nakamura, Tokyo, JP;

Assignee:

Semiconductor Energy Laboratory Co., Ltd., Atsugi-shi, Kanagawa-ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/786 (2006.01); H01L 21/768 (2006.01); H01L 27/12 (2006.01); H01L 29/45 (2006.01); H01L 29/49 (2006.01); H01L 29/66 (2006.01); H01L 21/02 (2006.01); H01L 21/324 (2006.01); H01L 29/24 (2006.01); H01L 29/423 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7869 (2013.01); H01L 21/0217 (2013.01); H01L 21/02164 (2013.01); H01L 21/324 (2013.01); H01L 21/76801 (2013.01); H01L 21/76828 (2013.01); H01L 21/76838 (2013.01); H01L 27/124 (2013.01); H01L 27/1225 (2013.01); H01L 29/24 (2013.01); H01L 29/42384 (2013.01); H01L 29/45 (2013.01); H01L 29/4908 (2013.01); H01L 29/66742 (2013.01); H01L 29/66969 (2013.01); H01L 29/78606 (2013.01); H01L 21/02554 (2013.01); H01L 21/02565 (2013.01); H01L 21/02631 (2013.01);
Abstract

By using a conductive layer including Cu as a long lead wiring, increase in wiring resistance is suppressed. Further, the conductive layer including Cu is provided in such a manner that it does not overlap with the oxide semiconductor layer in which a channel region of a TFT is formed, and is surrounded by insulating layers including silicon nitride, whereby diffusion of Cu can be prevented; thus, a highly reliable semiconductor device can be manufactured. Specifically, a display device which is one embodiment of a semiconductor device can have high display quality and operate stably even when the size or definition thereof is increased.


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