The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2020

Filed:

Aug. 03, 2018
Applicant:

Semiconductor Components Industries, Llc, Phoenix, AZ (US);

Inventors:

Bingzhi Su, Boise, ID (US);

Derek Gochnour, Boise, ID (US);

Larry Kinsman, Boise, ID (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 27/146 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/08 (2006.01); H01L 23/10 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14618 (2013.01); H01L 21/4803 (2013.01); H01L 21/561 (2013.01); H01L 23/08 (2013.01); H01L 23/10 (2013.01); H01L 23/315 (2013.01); H01L 23/3114 (2013.01); H01L 23/3142 (2013.01); H01L 23/564 (2013.01); H01L 24/13 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/16195 (2013.01); H01L 2924/16235 (2013.01); H01L 2924/16588 (2013.01); H01L 2924/1715 (2013.01);
Abstract

Implementations of semiconductor packages may include: a die coupled to a glass lid; one or more inner walls having a first material coupled to the die; an outer wall having a second material coupled to the die; and a glass lid coupled to the die at the one or more inner walls and at the outer wall; wherein the outer wall may be located at the edge of the die and the glass lid and the one or more inner walls may be located within the perimeter of the outer wall at a predetermined distance from the perimeter of the outer wall; and wherein a modulus of the first material may be lower than a modulus of the second material.


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