The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2020
Filed:
Feb. 13, 2017
Applicant:
Shindengen Electric Manufacturing Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
SHINDENGEN ELECTRIC MANUFACTURING CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 25/11 (2006.01); H01L 23/498 (2006.01); H03H 7/01 (2006.01); H05K 7/20 (2006.01); H01L 23/14 (2006.01); H03H 1/00 (2006.01); H01L 23/367 (2006.01); H01L 49/02 (2006.01); H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 23/36 (2006.01); H01L 25/07 (2006.01); H05K 7/14 (2006.01); H01L 23/373 (2006.01); H02M 1/44 (2007.01); H01L 23/522 (2006.01); H01L 25/00 (2006.01); H02M 7/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 25/162 (2013.01); H01L 23/145 (2013.01); H01L 23/36 (2013.01); H01L 23/3675 (2013.01); H01L 23/3735 (2013.01); H01L 23/49838 (2013.01); H01L 23/5227 (2013.01); H01L 23/552 (2013.01); H01L 23/564 (2013.01); H01L 25/00 (2013.01); H01L 25/071 (2013.01); H01L 25/072 (2013.01); H01L 25/117 (2013.01); H01L 28/10 (2013.01); H02M 1/44 (2013.01); H02M 7/003 (2013.01); H03H 1/00 (2013.01); H03H 7/0115 (2013.01); H05K 7/1432 (2013.01); H05K 7/209 (2013.01); H01L 23/3107 (2013.01); H01L 23/3121 (2013.01); H03H 2001/005 (2013.01); H03H 2001/0092 (2013.01);
Abstract
An electronic module comprising a first electronic unitwhich has a first insulating substrateand a first electronic elementprovided on the first insulating substratevia a first conductor layer, a second electronic unitwhich has a second insulating substrateand a second electronic elementprovided on the second insulating substratevia a second conductor layer, a connecting bodyprovided between the first electronic unitand the second electronic unitand a coilwound around the connecting body