The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2020
Filed:
Mar. 13, 2018
Applicant:
Stmicroelectronics S.r.l., Agrate Brianza, IT;
Inventor:
Federico Giovanni Ziglioli, Pozzo d'Adda, IT;
Assignee:
STMICROELECTRONICS S.r.l., Agrate Brianza, IT;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 21/768 (2006.01); H01L 25/00 (2006.01); H01L 21/288 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 21/288 (2013.01); H01L 21/76802 (2013.01); H01L 21/76877 (2013.01); H01L 23/3142 (2013.01); H01L 23/528 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 25/50 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/838 (2013.01); H01L 2224/83143 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/83855 (2013.01); H01L 2225/06551 (2013.01); H01L 2225/06555 (2013.01); H01L 2225/06593 (2013.01); H01L 2924/1433 (2013.01);
Abstract
A die structure includes a first die having a first surface and a second surface opposite the first surface. The first die includes sidewalls extending between the first and second surfaces. The die structure includes conductive ink printed traces including a first group of the conductive ink printed traces on the first surface of the first semiconductor die. A second group of the conductive ink printed traces are on the second surface of the semiconductor die, and a third group of the conductive ink printed traces are on the sidewalls of the semiconductor die.