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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10770426 B1

PDFFull Text
Date of Patent:
Sep. 08, 2020

Filed:

Aug. 21, 2017

Micro device transferring method, and micro device substrate manufactured by micro device transferring method

Applicant:

Center for Advanced Meta-materials, Daejeon, KR;

Inventors:

Yun Hwangbo, Daejeon, KR;

Byung Ik Choi, Daejeon, KR;

Jae Hyun Kim, Daejeon, KR;

Yeon Woo Jeong, Daejeon, KR;

Seong Min Hong, Daejeon, KR;

Bong Kyun Jang, Daejeon, KR;

Kwang Seop Kim, Daejeon, KR;

Kyung Sik Kim, Daejeon, KR;

Hak Joo Lee, Daejeon, KR;

Assignee:

CENTER FOR ADVANCED META-MATERIALS, Daejeon, KR;

Attorney:

Revolution IP, PLLC

Primary Examiner:

Jacob T Minskey

Assistant Examiner:

Matthew Hoover

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 25/00 (2006.01); H01L 33/00 (2010.01); H01L 23/00 (2006.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01); H01L 21/677 (2006.01); H01L 21/52 (2006.01); H01L 21/18 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); H01L 21/18 (2013.01); H01L 21/52 (2013.01); H01L 21/677 (2013.01); H01L 21/768 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 25/0753 (2013.01); H01L 33/62 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13113 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32059 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81201 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/83052 (2013.01); H01L 2224/83201 (2013.01); H01L 2224/83898 (2013.01); H01L 2924/014 (2013.01); H01L 2924/12041 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A method for transferring a micro device, includes: a compression step in which a carrier film having a micro-device attached to an adhesive layer thereof is brought into contact with a substrate comprising a solder deposited on metal electrodes formed on the substrate and is compressed on the substrate; a first adhesive strength generation step in which the solder disposed between the micro-device and the metal electrodes is compressed in the compression step to generate first adhesive strength between the micro-device and the solder; a second adhesive generation step in which the micro-device is bonded to the adhesive layer through press-fitting in the compression step to generate second adhesive strength between the micro-device and the adhesive layer; and a release step in which the carrier film is separated from the substrate, with the micro-device adhered to the solder.

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