The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2020

Filed:

Dec. 04, 2018
Applicant:

Cree, Inc., Durham, NC (US);

Inventors:

Frank Trang, San Jose, CA (US);

Haedong Jang, San Jose, CA (US);

Zulhazmi Mokhti, Morgan Hill, CA (US);

Assignee:

Cree, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 23/552 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H03H 7/38 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/565 (2013.01); H01L 23/315 (2013.01); H01L 23/552 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/85 (2013.01); H03H 7/38 (2013.01); H01L 2223/6611 (2013.01); H01L 2224/48096 (2013.01); H01L 2224/48195 (2013.01); H01L 2224/49176 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/30111 (2013.01);
Abstract

Packaged transistor devices are provided that include a transistor on a base of the packaged transistor device, the transistor comprising a control terminal and an output terminal, a first bond wire electrically coupled between an input lead and the control terminal of the transistor, a second bond wire electrically coupled between an output lead and the output terminal of the transistor, and an isolation material that is and physically between the first bond wire and the second bond wire, wherein the isolation material is configured to reduce a coupling between the first bond wire and the second bond wire.


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