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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10770400 B1

PDFFull Text
Expired
Date of Patent:
Sep. 08, 2020

Filed:

May. 12, 2017

Semiconductor module

Applicant:

Kabushiki Kaisha Toyota Jidoshokki, Aichi-ken, JP;

Inventors:

Naoki Kato, Aichi-ken, JP;

Shogo Mori, Aichi-ken, JP;

Harumitsu Sato, Aichi-ken, JP;

Hiroki Watanabe, Aichi-ken, JP;

Hiroshi Yuguchi, Aichi-ken, JP;

Yuri Otobe, Aichi-ken, JP;

Assignee:

KABUSHIKI KAISHA TOYOTA JIDOSHOKKI, Aichi, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

Robert G Bachner

Int. Cl.
CPC ...
H01L 23/12 (2006.01); H01L 23/538 (2006.01); H01L 25/18 (2006.01); H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5386 (2013.01); H01L 23/48 (2013.01); H01L 23/5385 (2013.01); H01L 24/01 (2013.01); H01L 24/38 (2013.01); H01L 24/40 (2013.01); H01L 24/41 (2013.01); H01L 24/84 (2013.01); H01L 25/0655 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01); H01L 24/29 (2013.01); H01L 24/37 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/40095 (2013.01); H01L 2224/40997 (2013.01); H01L 2224/40998 (2013.01); H01L 2224/41175 (2013.01); H01L 2224/84138 (2013.01); H01L 2224/84801 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01);
Abstract

A semiconductor module includes a substrate, two bare chips (semiconductor elements) mounted on the substrate, and a case fixed to the substrate. A conductor pattern and five signal patterns are provided for each bare chip on an upper surface of an insulating substrate. Signal electrodes and the signal patterns of the bare chips are connected to by conductive plates. An insulating member is provided on connecting portions of the conductive plates.

Find Patent Forward Citations

Kato, Naoki. (2020). Semiconductor module (U.S. Patent No. 10770400). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10770400

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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