The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2020

Filed:

Nov. 29, 2018
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Christopher James Kapusta, Delanson, NY (US);

Ramanujam Ramabhadran, Niskayuna, NY (US);

Kum-Kang Huh, Niskayuna, NY (US);

Brian Lynn Rowden, Ballston Lake, NY (US);

Glenn Scott Claydon, Wynantskill, NY (US);

Ahmed Elasser, Latham, NY (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/64 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 29/20 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/498 (2013.01); H01L 21/56 (2013.01); H01L 23/5385 (2013.01); H01L 23/645 (2013.01); H01L 24/17 (2013.01); H01L 29/2003 (2013.01); H01L 2924/1033 (2013.01);
Abstract

A modular electronics package is disclosed that includes a first and second electronics packages, with each of the first and second electronics packages including a metallized insulating substrate and a solid-state switching device positioned on the metallized insulating substrate, the solid-state switching device comprising a plurality of contact pads electrically coupled to the first conductor layer of the metallized insulating substrate. A conductive joining material is positioned between the first electronics package and the second electronics package to electrically connect them together. The first electronics package and the second electronics package are stacked with one another to form a half-bridge unit cell, with the half-bridge unit cell having a current path through the solid-state switching device in the first electronics package and a close coupled return current path through the solid-state switching device in the second electronics package in opposite flow directions.


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