The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2020
Filed:
Nov. 11, 2016
Mitsubishi Electric Corporation, Tokyo, JP;
Yosuke Nakata, Tokyo, JP;
Yuji Imoto, Tokyo, JP;
Taishi Sasaki, Tokyo, JP;
Tatsuya Kawase, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A semiconductor chip () is bonded to an upper surface of the conductive substrate (). A control terminal () is disposed outside the semiconductor chip () and connected to a control electrode of the semiconductor chip () via a lead (). A case () surrounds the semiconductor chip (). A sealing material () seals the semiconductor chip (). The lead frame () includes a bonded part () joined to the semiconductor chip (), and an upright part () embedded in the case (), extending from the bonded part () to an outer side of the control terminal (), and standing upright vertically relative to an upper surface of the semiconductor chip ().