logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10770370 B1

PDFFull Text
Date of Patent:
Sep. 08, 2020

Filed:

Jun. 27, 2019

Electronic device and heat dissipating sheet

Applicant:

Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;

Inventors:

Shinichi Hirose, Yokohama, JP;

Daiyu Kondo, Atsugi, JP;

Assignee:

FUJITSU LIMITED, Kawasaki, JP;

Attorney:

Fujitsu Patent Center

Primary Examiner:

Mukundbhai G Patel

Int. Cl.
CPC ...
H01L 23/373 (2006.01); F28F 13/18 (2006.01); F28F 21/02 (2006.01); H01L 21/48 (2006.01); H01L 23/367 (2006.01); B82Y 30/00 (2011.01); H01L 23/053 (2006.01); F28F 13/00 (2006.01); H01L 23/043 (2006.01); H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3737 (2013.01); F28F 13/18 (2013.01); F28F 21/02 (2013.01); H01L 21/481 (2013.01); H01L 23/3675 (2013.01); H01L 23/373 (2013.01); B82Y 30/00 (2013.01); F28F 2013/006 (2013.01); F28F 2255/20 (2013.01); H01L 23/043 (2013.01); H01L 23/053 (2013.01); H01L 23/10 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/73253 (2013.01);
Abstract

An electronic device includes a component, a resin film formed to the component, and a plurality of carbon nanotubes whose end portions pass through the resin film and are in contact with the component, wherein a first portion of each of the carbon nanotubes is covered with the resin film, the first portion has a first length which is greater than a thickness of the resin film, and an intermediate portion of each of the carbon nanotubes other than the first portion is uncovered with and exposed from the resin.

Find Patent Forward Citations

Hirose, Shinichi. (2020). Electronic device and heat dissipating sheet (U.S. Patent No. 10770370). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10770370

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…