The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2020
Filed:
Mar. 10, 2017
Toho Engineering Co., Ltd., Yokkaichi-shi, JP;
TOHO ENGINEERING CO., LTD., Yokkaichi-Shi, JP;
Abstract
A planarization processing device for polishing a substrate, e.g., a semiconductor wafer, includes two planarization processing sections (SP, SP) that each include a holder () for holding a workpiece (W), a drive motor () that rotates the holder (), a support plate () holds a pad (), a linear guide () that guides reciprocal movement of the support plate () in a direction parallel to the surface of the pad (), and a drive cylinder () that advances the holder () or the support plate () in a direction that intersects the surface of the workpiece W or the pad () to cause the opposing surfaces of the workpiece and the pad () to be at least proximal to each other. A primary driver (PD) causes the support plates () of the planarization processing sections (SP, SP) to reciprocate along the same straight line in opposite phases.