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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10770205 B1

PDFFull Text
Date of Patent:
Sep. 08, 2020

Filed:

Oct. 10, 2017

Method for manufacturing electronic component

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Haruhiko Mori, Nagaokakyo, JP;

Hiroyuki Otsuna, Nagaokakyo, JP;

Assignee:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Attorney:

Keating & Bennett, LLP

Primary Examiner:

A Dexter Tugbang

Int. Cl.
CPC ...
H01G 7/00 (2006.01); H01G 4/248 (2006.01); H01C 7/00 (2006.01); H01G 4/30 (2006.01); H01F 17/00 (2006.01); H01C 1/148 (2006.01); H01C 7/18 (2006.01); H01G 4/232 (2006.01); H01F 17/04 (2006.01); H01G 4/252 (2006.01); H01G 4/12 (2006.01); H01G 4/012 (2006.01);
U.S. Cl.
CPC ...
H01C 7/008 (2013.01); H01C 1/148 (2013.01); H01C 7/18 (2013.01); H01F 17/0013 (2013.01); H01F 17/04 (2013.01); H01G 4/2325 (2013.01); H01G 4/248 (2013.01); H01G 4/252 (2013.01); H01G 4/30 (2013.01); H01G 4/012 (2013.01); H01G 4/12 (2013.01); Y10T 29/43 (2015.01); Y10T 29/435 (2015.01); Y10T 29/49121 (2015.01); Y10T 29/49124 (2015.01);
Abstract

A method for manufacturing an electronic component including a step of providing an outer electrode that includes a step of providing a sintered layer containing a sintered metal, a step of providing an insulation layer containing an electric insulation material, and a step of providing a Sn-containing layer containing Sn. The sintered layer extends from each of end surfaces of an element assembly onto at least one main surface thereof. The insulation layer is directly provided on the sintered layer at each of the end surfaces so as to extend in a direction perpendicular or substantially perpendicular to a side surface of the element assembly, and defines a portion of a surface of the outer electrode. The Sn-containing layer covers the sintered layer except for a portion of the sintered layer that is covered by the insulation layer, and constitutes another portion of the surface of the outer electrode.

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