The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2020
Filed:
Apr. 17, 2019
Taiwan Textile Research Institute, New Taipei, TW;
Jie-Shen Tsai, New Taipei, TW;
Chien-Lung Shen, New Taipei, TW;
TAIWAN TEXTILE RESEARCH INSTITUTE, New Taipei, TW;
Abstract
A radio frequency yarn module includes a first flexible substrate, a radio frequency assembly, and a first packaging adhesive. The first flexible substrate is strip shaped and has a thickness ranging from 40 μm to 60 μm. The radio frequency assembly is disposed on the first flexible substrate and includes a first conductive layer, a second conductive layer, and a radio frequency chip. Each of the first and the second conductive layers is disposed on the first flexible substrate and has a thickness ranging from 3 μm to 10 μm. Extending paths of the first and the second conductive layers are respectively same as extending paths of a first and a second portions of the first flexible substrate. The radio frequency chip is disposed on the first conductive layer and the second conductive layer. The first packaging adhesive covers the radio frequency assembly.