The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2020

Filed:

Jun. 30, 2016
Applicant:

Huawei Technologies Co., Ltd., Shenzhen, CN;

Inventors:

Dongli Wang, Dongguan, CN;

Xiaoyan Yu, Shenzhen, CN;

Jiang Liu, Shenzhen, CN;

Ziqian Ding, Munich, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/041 (2006.01); G06F 3/045 (2006.01); G06F 1/16 (2006.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
G06F 3/0416 (2013.01); G06F 1/1626 (2013.01); G06F 3/041 (2013.01); H01L 27/323 (2013.01); G06F 2203/04102 (2013.01); G06F 2203/04103 (2013.01);
Abstract

An electronic device includes: a foam is located below an OLED display, and a film is located below the foam. Multiple bridge circuits are disposed on the film. Each bridge circuit includes two parallel branches. A first branch includes a first and a third resistor. A second branch includes a second and a fourth resistor. At least one of the four resistors is bonded to the foam. At least one resistor is not bonded to the foam. The resistor that is bonded to the foam is made from a first material. A strain sensitivity coefficient of the first material is greater than 100. A film area in which the resistor that is bonded to the foam is located is covered by a second material. A Young's modulus of the second material is greater than 30.


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