The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2020

Filed:

Dec. 07, 2018
Applicant:

SK Hynix Inc., Icheon-si Gyeonggi-do, KR;

Inventor:

Yong Seop Kim, Seoul, KR;

Assignee:

SK hynix Inc., Icheon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); G11C 29/56 (2006.01); G01R 31/3185 (2006.01); G01R 31/3181 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2853 (2013.01); G01R 31/31813 (2013.01); G01R 31/318513 (2013.01); G11C 29/56004 (2013.01); G11C 29/56008 (2013.01);
Abstract

A semiconductor device may include a plurality of chips and a test pad. The plurality of chips may check parity bits of a plurality of pattern signals activated in units of specific bits and store test result signals generated by the checking of the parity bits. The plurality of chips may output an error detection signal when an error is detected from any of the test result signals. The test pad may output the error detection signal received from the plurality of chips to an external part. The plurality of chips may be commonly coupled to at least one connection line such that, when the error detection signal is output from at least one of the plurality of chips, the outputted error detection signal s output through the test pad.


Find Patent Forward Citations

Loading…