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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10767832 B1

PDFFull Text
Date of Patent:
Sep. 08, 2020

Filed:

May. 15, 2017

Light source module for vehicle

Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Kyoung Soo Ahn, Seoul, KR;

Sang Hyun An, Seoul, KR;

Dong Il Eom, Seoul, KR;

Jae Myeong Noh, Seoul, KR;

Assignee:

LG INNOTEK CO., LTD., Seoul, KR;

Attorney:

KED & Associates LLP

Primary Examiner:

Y M Quach Lee

Int. Cl.
CPC ...
F21S 41/43 (2018.01); F21S 45/47 (2018.01); F21S 45/49 (2018.01); F21S 41/47 (2018.01); F21S 41/19 (2018.01); F21S 41/148 (2018.01); F21S 41/663 (2018.01); F21V 29/51 (2015.01); F21S 41/147 (2018.01); F21S 43/14 (2018.01); F21S 43/19 (2018.01); F21S 41/40 (2018.01); F21W 102/13 (2018.01); F21Y 107/90 (2016.01); F21Y 105/12 (2016.01);
U.S. Cl.
CPC ...
F21S 45/47 (2018.01); F21S 41/147 (2018.01); F21S 41/148 (2018.01); F21S 41/192 (2018.01); F21S 41/198 (2018.01); F21S 41/40 (2018.01); F21S 41/43 (2018.01); F21S 41/47 (2018.01); F21S 41/663 (2018.01); F21S 43/14 (2018.01); F21S 43/19 (2018.01); F21S 45/49 (2018.01); F21V 29/51 (2015.01); F21W 2102/13 (2018.01); F21Y 2105/12 (2016.08); F21Y 2107/90 (2016.08);
Abstract

The present invention provides a light source module for a vehicle comprising: a plate-like heat sink; substrates provided on both sides of the heat sink, respectively; light emitting devices provided on the substrates, respectively; a hole for transmitting light emitted from the light emitting devices; and a pair of bases coupled to the outside of the substrates, wherein the light emitting device includes a first light emitting device and a second light emitting device which are arranged diagonally, and a blocking member is disposed at a lower end of the second light emitting device. As such, it is possible to increase the heat dissipation efficiency by increasing the contact between the heat sink and the substrates.

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