The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2020
Filed:
Sep. 13, 2016
Sika Technology Ag, Baar, CH;
Doreen Janke, Alveslohe, DE;
Kai Paschkowski, Jork, DE;
Mathias Cordes, Hamburg, DE;
Dirk Urbach, Ahrensburg, DE;
SIKA TECHNOLOGY AG, Baar, CH;
Abstract
A hot-melt glue composition, including a) at least one atactic poly-α-olefin (APAO) that is solid at 25° C.; b) at least one hydrocarbon resin having a softening point of at least 80° C., measured in accordance with the ring-and-ball method according to DIN EN 1238; and c) at least one maleic-anhydride-grafted wax having a softening point of not more than 150° C., measured in accordance with the ring-and-ball method according to DIN EN 1238, which is a maleic-anhydride-grafted polypropylene wax or a maleic-anhydride-grafted polyethylene wax, wherein the proportion of the at least one maleic-anhydride-grafted wax in the hot-melt glue composition is at least 3 wt %. The hot-melt glue composition is characterized by a low reactivation temperature, together with high heat resistance and good adhesion to ABS and nonpolar polyolefin materials. The hot-melt glue composition is well suited for film lamination by vacuum deep-drawing lamination, in particular for applications in automobile construction.