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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10767051 B1

PDFFull Text
Date of Patent:
Sep. 08, 2020

Filed:

Sep. 28, 2017

Cured body and multilayered substrate

Applicant:

Sekisui Chemical Co., Ltd., Osaka, Osaka, JP;

Inventors:

Tatsushi Hayashi, Tsukuba, JP;

Takashi Nishimura, Tsukuba, JP;

Susumu Baba, Tsukuba, JP;

Assignee:

SEKISUI CHEMICAL CO., LTD., Osaka, JP;

Attorney:

Cheng Law Group, PLLC

Primary Examiner:

Elizabeth E Mulvaney

Int. Cl.
CPC ...
B32B 3/00 (2006.01); C08L 79/08 (2006.01); C08L 63/00 (2006.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
C08L 79/08 (2013.01); C08L 63/00 (2013.01); H05K 1/0373 (2013.01); H05K 3/0055 (2013.01); C08L 2203/20 (2013.01); H05K 3/0032 (2013.01); H05K 3/423 (2013.01); H05K 3/429 (2013.01); H05K 2201/0154 (2013.01); H05K 2203/0793 (2013.01); H05K 2203/107 (2013.01);
Abstract

Provided is a cured body that can enhance the adhesion between an insulating layer and a metal layer, and can reduce the surface roughness on a surface of the insulating layer. The cured body according to the present invention is a cured body of a resin composition that includes an epoxy compound, a curing agent, an inorganic filler, and a polyimide, in which the content of the inorganic filler is 30% by weight or more and 90% by weight or less in 100% by weight of the cured body, the cured body has a sea-island structure having a sea part and an island part, the island part has an average long diameter of 5 μm or less, and the island part contains the polyimide.

Find Patent Forward Citations

Hayashi, Tatsushi. (2020). Cured body and multilayered substrate (U.S. Patent No. 10767051). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10767051

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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