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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10767046 B1

PDFFull Text
Date of Patent:
Sep. 08, 2020

Filed:

Jul. 03, 2017

Polyamide resin molded body

Applicant:

Asahi Kasei Kabushiki Kaisha, Tokyo, JP;

Inventors:

Tetsuo Kurihara, Tokyo, JP;

Hiroshi Oyamada, Tokyo, JP;

Yasuo Kawaji, Tokyo, JP;

Assignee:

ASAHI KASEI KABUSHIKI KAISHA, Tokyo, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

Christopher M Rodd

Int. Cl.
CPC ...
C08L 77/02 (2006.01); C10M 169/04 (2006.01); C08L 27/12 (2006.01); C08L 77/00 (2006.01); C08L 77/06 (2006.01); C08L 27/18 (2006.01); C10N 20/06 (2006.01); C10N 30/02 (2006.01); C10N 30/06 (2006.01); C10N 50/00 (2006.01);
U.S. Cl.
CPC ...
C08L 77/02 (2013.01); C08L 27/12 (2013.01); C08L 27/18 (2013.01); C08L 77/00 (2013.01); C08L 77/06 (2013.01); C10M 169/041 (2013.01); C10M 2201/081 (2013.01); C10M 2213/062 (2013.01); C10M 2217/0443 (2013.01); C10N 2020/06 (2013.01); C10N 2030/02 (2013.01); C10N 2030/06 (2013.01); C10N 2050/025 (2020.05);
Abstract

A polyamide resin molded body is formed by a resin composition having a (B) fluorine series resin within a range from 1 to 15 parts by mass with respect to 100 parts by mass of a (A) polyamide resin. In the resin composition, the number average particle diameter of the fluorine series resin dispersed in the polyamide resin is 0.8 μm or less. The resin composition includes particles of the (B) fluorine series resin having particle diameters of 0.8 μm or greater. The percentage of particles having particle diameters of 0.8 μm or greater which are secondary particles while maintaining the form of primary particles is 60% or greater, and/or the degree of crystallinity of the dispersed (B) fluorine series resin is 42 J/g or greater.

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