The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2020
Filed:
Jun. 20, 2017
Applicant:
Sika Technology Ag, Baar, CH;
Inventor:
John Hanley, Sterling Heights, MI (US);
Assignee:
SIKA TECHNOLOGY AG, Baar, CH;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/20 (2006.01); C08J 5/00 (2006.01); C08J 9/06 (2006.01); C08J 9/12 (2006.01); B32B 5/18 (2006.01); B32B 27/38 (2006.01); C08L 63/00 (2006.01); C08J 5/24 (2006.01); C08J 9/00 (2006.01); C08J 9/10 (2006.01); C09D 5/00 (2006.01); C09D 163/00 (2006.01); C08G 59/42 (2006.01); C08G 18/48 (2006.01); C08J 9/08 (2006.01); C09J 163/00 (2006.01); C08G 18/73 (2006.01); C08G 59/40 (2006.01); C08J 9/32 (2006.01); C08G 18/10 (2006.01); C08G 59/22 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); C08G 18/10 (2013.01); C08G 18/4854 (2013.01); C08G 18/73 (2013.01); C08G 59/4021 (2013.01); C08G 59/4246 (2013.01); C08G 59/4253 (2013.01); C08J 5/24 (2013.01); C08J 9/0061 (2013.01); C08J 9/0066 (2013.01); C08J 9/08 (2013.01); C08J 9/103 (2013.01); C08J 9/105 (2013.01); C08J 9/32 (2013.01); C09D 5/00 (2013.01); C09D 163/00 (2013.01); C09J 163/00 (2013.01); C08G 59/22 (2013.01); C08G 59/226 (2013.01); C08J 2203/02 (2013.01); C08J 2203/04 (2013.01); C08J 2203/22 (2013.01); C08J 2205/10 (2013.01); C08J 2363/00 (2013.01); C08J 2363/02 (2013.01); C08J 2409/00 (2013.01); C08J 2409/02 (2013.01); C08J 2463/00 (2013.01); C08J 2475/04 (2013.01); C08J 2475/08 (2013.01); C08L 2203/14 (2013.01); C08L 2205/025 (2013.01); C08L 2205/035 (2013.01);
Abstract
Thermosetting epoxy resin compositions on the one hand at room temperature in the incompletely cured state exhibit extremely slight alteration in shape and on the other hand develop a high surface tack, and, moreover, in the fully cured state are of high impact strength and at the same time exhibits high adhesion, particularly to metallic substrates. These compositions are ideally suited to the production of self-adhesive reinforcing elements.