The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2020
Filed:
Oct. 05, 2018
Applicant:
Denso Corporation, Aichi-pref, JP;
Inventors:
Yoshihito Takahashi, Toyota, JP;
Daisuke Ito, Toyota, JP;
Assignee:
DENSO CORPORATION, Kariya, Aichi-Pref., JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/06 (2006.01); H05K 3/46 (2006.01); B32B 37/18 (2006.01); B32B 27/08 (2006.01); B32B 27/38 (2006.01);
U.S. Cl.
CPC ...
B32B 37/06 (2013.01); B32B 27/08 (2013.01); B32B 27/38 (2013.01); B32B 37/182 (2013.01); H05K 3/462 (2013.01); H05K 3/4644 (2013.01); B32B 2255/10 (2013.01); B32B 2255/205 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2457/08 (2013.01); H05K 3/4638 (2013.01); H05K 2203/0195 (2013.01); H05K 2203/068 (2013.01);
Abstract
A method of manufacturing a multilayer substrate includes preparing a plurality of substrates, stacking the substrates with bonding sheets interposed, and a first bonding process of bonding the substrates to each other by partially heating the stacked substrates by a heater and partially melting the bonding sheet. Each of the substrates is provided with a through-hole and a metal film covering an inner peripheral surface of the through-hole. In the first bonding process, the metal film is heated by the heater and heat is transferred from the heater to the bonding sheet via the metal film.