The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2020
Filed:
Dec. 31, 2014
Brian Wilson, Greer, SC (US);
Jim Endicott, Greenville, SC (US);
Chad Lane, Spartanburg, SC (US);
Clay Bohn, Mauldin, SC (US);
Brian Wilson, Greer, SC (US);
Jim Endicott, Greenville, SC (US);
Chad Lane, Spartanburg, SC (US);
Clay Bohn, Mauldin, SC (US);
Compagnie Generale des Etablissements Michelin, Clermont-Ferrand, FR;
Abstract
Particular embodiments of the invention include apparatus and methods for compensating for shrinkage of a polymeric material in a mold during curing operations. Embodiments of the method include providing a mold comprising a molding cavity defining an interior mold volume separated from an exterior environment and introducing a volume of polymeric material into the molding cavity. Such methods further include impeding the development of a void in the volume of polymeric material by, either: isolating the volume of polymeric material within the molding cavity from the exterior environment, or reducing the interior mold volume of the molding cavity to at least substantially consume a volume of polymeric material shrinkage. Such methods further include curing the polymeric material to form a molded polymeric form.