The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2020

Filed:

Jun. 17, 2016
Applicant:

Eternal Materials Co., Ltd., Kaohsiung, TW;

Inventors:

Shun-Jen Chiang, Kaohsiung, TW;

Chung-Jen Wu, Kaohsiung, TW;

Meng-Yen Chou, Kaohsiung, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/08 (2006.01); B32B 27/28 (2006.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01); C09D 179/08 (2006.01); H05K 3/02 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0097 (2013.01); B32B 15/08 (2013.01); B32B 27/281 (2013.01); C09D 179/08 (2013.01); H05K 1/0326 (2013.01); H05K 1/0346 (2013.01); H05K 3/022 (2013.01); B32B 2250/04 (2013.01); B32B 2250/40 (2013.01); B32B 2307/748 (2013.01); B32B 2457/08 (2013.01); H05K 2201/0154 (2013.01); H05K 2203/0143 (2013.01); H05K 2203/1545 (2013.01);
Abstract

The present disclosure provides a metal clad laminate, a preparation method thereof, and a method for preparing a flexible circuit board by using the same. The metal clad laminate of the present disclosure includes a first metal foil, a first polyimide layer directly disposed on the first metal foil, a second metal foil, and a second polyimide layer directly disposed on the second metal foil, the first polyimide layer being in contact with the second polyimide layer. The metal clad laminate of the present disclosure is equivalent to a double-sided flexible copper clad laminate (FCCL) in structure, is superior to a single-sided FCCL in terms of mechanical performance in reducing warpage, and has the advantage of being useful for circuit fabrication simultaneously on both sides thereof.


Find Patent Forward Citations

Chiang, Shun-Jen. (2020). Metal clad laminate, preparation method thereof, and method for preparing flexible circuit board by using the same (U.S. Patent No. 10765008). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10765008

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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