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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10765001 B1

PDFFull Text
Date of Patent:
Sep. 01, 2020

Filed:

Mar. 30, 2016

Thermoplastic liquid crystal polymer film, circuit board, and methods respectively for manufacturing said film and said circuit board

Applicant:

Kuraray Co., Ltd., Kurashiki-shi, JP;

Inventors:

Takahiro Nakashima, Saijo, JP;

Takeshi Takahashi, Saijo, JP;

Minoru Onodera, Saijo, JP;

Assignee:

KURARAY CO., LTD., Kurashiki-shi, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Steven T Sawyer

Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/03 (2006.01); B32B 15/08 (2006.01); B32B 27/08 (2006.01); B32B 15/20 (2006.01); H05K 3/46 (2006.01); C08J 5/18 (2006.01); B32B 3/04 (2006.01); B32B 7/05 (2019.01); C09K 19/38 (2006.01); B32B 27/36 (2006.01);
U.S. Cl.
CPC ...
H05K 1/036 (2013.01); B32B 3/04 (2013.01); B32B 7/05 (2019.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); B32B 27/08 (2013.01); C08J 5/18 (2013.01); C09K 19/3809 (2013.01); H05K 1/0298 (2013.01); H05K 1/0326 (2013.01); H05K 3/4611 (2013.01); H05K 3/4632 (2013.01); B32B 27/36 (2013.01); B32B 2307/306 (2013.01); B32B 2307/50 (2013.01); B32B 2457/08 (2013.01); C08J 2367/04 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/0141 (2013.01);
Abstract

Provided are a thermoplastic liquid crystal polymer film having an improved thermo-adhesive property, a circuit board, and methods respectively for producing the same. The thermoplastic liquid crystal polymer film has a segment orientation ratio SOR of 0.8 to 1.4 and a moisture content of 300 ppm or less. The circuit board contains a plurality of circuit board materials wherein the circuit board materials are at least one member selected from the group consisting of an insulating substrate having a conductor layer on at least one surface, a bonding sheet, and a coverlay. At least one of the circuit board materials includes a thermoplastic liquid crystal polymer film. The circuit board shows a solder heat resistance when the circuit board is placed in a solder bath at 290° C. for 60 seconds in accordance with JIS C 5012.

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