The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2020
Filed:
Jun. 19, 2019
Nippon Mektron, Ltd., Tokyo, JP;
Fumihiko Matsuda, Tokyo, JP;
Shoji Takano, Tokyo, JP;
NIPPON MEKTRON, LTD., Tokyo, JP;
Abstract
A method for manufacturing a multilayer printed circuit board includes: preparing a first wiring substrate having a first insulating resin film having a first circuit pattern formed on a first main surface, and a first protective film releasably bonded to a second main surface; partially removing the first protective film and the first insulating resin film to form a bottomed via hole having the first circuit pattern exposed on a bottom surface; filling the bottomed via hole with a conductive paste; disposing a second protective film on the first protective film to cover the bottomed via hole filled with the conductive paste; removing an unnecessary portion of the first wiring substrate after the second protective film is disposed on the first protective film; and peeling off the first protective film and the second protective film from the first wiring substrate after the unnecessary portion is removed.