The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2020
Filed:
Mar. 13, 2019
Applicant:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Inventors:
Tamio Ikehashi, Kanagawa, JP;
Hiroaki Yamazaki, Kanagawa, JP;
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H03H 7/38 (2006.01); H01L 41/09 (2006.01); H01L 41/04 (2006.01); H01H 59/00 (2006.01); H01L 41/053 (2006.01); H01H 37/04 (2006.01);
U.S. Cl.
CPC ...
H03H 7/38 (2013.01); H01H 37/04 (2013.01); H01H 59/00 (2013.01); H01L 41/042 (2013.01); H01L 41/0533 (2013.01); H01L 41/09 (2013.01);
Abstract
According to one embodiment, an IC chip includes a plurality of fuse elements including a plurality of fuse portions each of which is to be cut off by a stress, and a plurality of actuator portions provided for the plurality of fuse portions, respectively, and each of which applies a stress to corresponding one of fuse portions, and a control circuit supplying a control signal for cutting off desired one of the fuse portions to corresponding one of the actuator portions.