The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2020
Filed:
Mar. 08, 2017
Applicant:
Lg Chem, Ltd., Seoul, KR;
Inventors:
Rae Hwan Jo, Daejeon, KR;
Eun Kyung Kim, Daejeon, KR;
Yong Ju Lee, Daejeon, KR;
Su Jin Park, Daejeon, KR;
Hyun Chul Kim, Daejeon, KR;
Jung Hyun Choi, Daejeon, KR;
Assignee:
LG Chem, Ltd., , KR;
Primary Examiner:
Int. Cl.
CPC ...
H01M 4/134 (2010.01); H01M 4/36 (2006.01); H01M 10/052 (2010.01); H01M 4/62 (2006.01); H01M 4/38 (2006.01); C01B 33/021 (2006.01); H01M 4/1395 (2010.01);
U.S. Cl.
CPC ...
H01M 4/134 (2013.01); C01B 33/021 (2013.01); H01M 4/1395 (2013.01); H01M 4/362 (2013.01); H01M 4/364 (2013.01); H01M 4/386 (2013.01); H01M 4/623 (2013.01); H01M 4/624 (2013.01); H01M 10/052 (2013.01);
Abstract
The present invention relates to a silicon-based active material-polymer composite which is secondary particles in which silicon-based particles as primary particles and conductive polymer particles having a modulus of elasticity of 10 Pa to 100 Pa at a temperature of 20° C. to 40° C. are uniformly mixed. The uniform mixture with the elastic conductive polymer particles provides for a buffering action against the stress generated by volumetric changes of the silicon-based particles.