The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2020

Filed:

Jun. 02, 2017
Applicants:

Christopher F. Kirby, Gambrills, MD (US);

Vivien M. Luu, Linthicum, MD (US);

Michael Rennie, Ashland, VA (US);

Sean R. Mclaughlin, Severn, MD (US);

Inventors:

Christopher F. Kirby, Gambrills, MD (US);

Vivien M. Luu, Linthicum, MD (US);

Michael Rennie, Ashland, VA (US);

Sean R. McLaughlin, Severn, MD (US);

Assignee:

NORTHROP GRUMMAN SYSTEMS CORPORATION, Falls Church, VA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 39/24 (2006.01); H01L 21/02 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01); H01L 21/285 (2006.01);
U.S. Cl.
CPC ...
H01L 39/2406 (2013.01); H01L 21/02063 (2013.01); H01L 21/2855 (2013.01); H01L 21/7684 (2013.01); H01L 21/76877 (2013.01); H01L 21/76879 (2013.01); H01L 21/76891 (2013.01); H01L 23/5226 (2013.01); H01L 23/53285 (2013.01); H01L 39/2445 (2013.01); H01L 21/76807 (2013.01); H01L 21/76814 (2013.01);
Abstract

A method of forming a superconductor interconnect structure is disclosed. The method includes forming a dielectric layer overlying a substrate, forming an interconnect opening in the dielectric layer, and moving the substrate to a deposition chamber. The method further includes depositing a superconducting metal in the interconnect opening, by performing a series of superconducting deposition and cooling processes to maintain a chamber temperature at or below a predetermined temperature until the superconducting metal has a desired thickness, to form a superconducting element in the superconductor interconnect structure.


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