The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2020

Filed:

Aug. 26, 2018
Applicant:

Kaistar Lighting (Xiamen) Co., Ltd, Xiamen, CN;

Inventor:

Jingqiong Zhang, Xiamen, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/205 (2006.01); H01L 33/00 (2010.01); H01L 33/64 (2010.01); H01L 33/48 (2010.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/644 (2013.01); H01L 33/486 (2013.01); H01L 33/642 (2013.01); H01L 33/647 (2013.01); H01L 25/0753 (2013.01); H01L 33/62 (2013.01); H01L 33/641 (2013.01);
Abstract

A LED leadframe for securing a LED chip includes a metallic base and an insulating layer. The metallic base includes a die bonding region and a peripheral region surrounding the die bonding region, and the die bonding region is for securing the LED chip. The insulating layer is disposed on the metallic base and located in the peripheral region to define the die bonding region. The insulating layer includes a bar-shaped insulating section disposed in the metallic base and corresponding to the die bonding region. The metallic base includes a first groove(s) defined corresponding to the die bonding region. The first groove(s) is/are filled with a thermally conductive filler. The invention improves the LED leadframe to allow heat conducting efficiencies of various regions of the base to be controllable and adjustable so as to reduce temperature differences among various regions of the base and thereby unify the temperature.


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