The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2020

Filed:

Jun. 03, 2016
Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Boe Optical Science and Technology Co., Ltd., Suzhou, Jiangsu, CN;

Inventor:

Tao Wang, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/38 (2010.01); H01L 33/00 (2010.01); G09F 9/33 (2006.01); H01L 23/00 (2006.01); H01L 33/48 (2010.01); H01L 33/64 (2010.01); H01L 23/488 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); G09F 9/33 (2013.01); H01L 24/29 (2013.01); H01L 33/00 (2013.01); H01L 33/38 (2013.01); H01L 33/486 (2013.01); H01L 23/488 (2013.01); H01L 23/498 (2013.01); H01L 33/642 (2013.01); H01L 2224/2912 (2013.01); H01L 2224/29028 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29147 (2013.01); H01L 2924/014 (2013.01); H01L 2924/12041 (2013.01);
Abstract

The present application relates to a light emitting diode, a light emitting device, and a display device. The light emitting device includes a light emitting diode and a substrate; the substrate is coated with a bonding substance; the light emitting diode is provided with a positive electrode pad and a negative electrode pad; the surface of the positive electrode pad and/or the negative electrode pad is provided with a plurality of protrusions which are embedded in the bonding substance; and the positive electrode pads and the negative electrode pads are fixed to the substrate through the bonding substance. The embodiment of the present application provides projections on the pad of the light emitting diode, avoids the need of increasing the area of the pad, increases the contact area between the pad and the solder with the constant pad area, improves the bonding stability between the light emitting diode and the substrate, and reduces the production cost.


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