logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10763407 B1

PDFFull Text
Date of Patent:
Sep. 01, 2020

Filed:

Mar. 29, 2019

Light emitting device

Applicant:

Nichia Corporation, Anan-shi, Tokushima, JP;

Inventors:

Yoshio Ichihara, Anan, JP;

Mitsuhiro Isono, Itago-gun, JP;

Assignee:

NICHIA CORPORATION, Anan-Shi, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Eduardo A Rodela

Int. Cl.
CPC ...
H01L 33/54 (2010.01); H01L 33/48 (2010.01); H01L 33/56 (2010.01); H01L 33/60 (2010.01); H01L 23/00 (2006.01); H01L 33/62 (2010.01); H01L 23/16 (2006.01); H01L 23/31 (2006.01); H01L 23/04 (2006.01); H01L 23/02 (2006.01); H01L 23/28 (2006.01); H01L 33/44 (2010.01); H01L 23/10 (2006.01); H01L 33/52 (2010.01);
U.S. Cl.
CPC ...
H01L 33/54 (2013.01); H01L 23/02 (2013.01); H01L 23/04 (2013.01); H01L 23/10 (2013.01); H01L 23/16 (2013.01); H01L 23/28 (2013.01); H01L 23/31 (2013.01); H01L 23/3107 (2013.01); H01L 23/3142 (2013.01); H01L 24/48 (2013.01); H01L 33/44 (2013.01); H01L 33/483 (2013.01); H01L 33/486 (2013.01); H01L 33/52 (2013.01); H01L 33/56 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/12041 (2013.01);
Abstract

Alight emitting device includes a package, alight emitting element, and a light-transmissive encapsulant. The package has a top surface and a recessed portion formed with an opening at the top surface. The light emitting element is located on a bottom surface of the recessed portion. The light-transmissive encapsulant is supplied in the recessed portion. The package is provided with a groove formed in the top surface and surrounding the opening. A surface of the groove includes depressed portions and projecting portions. The encapsulant covers at least a part of the surface of the groove, and a portion of the encapsulant that covers the surface of the groove includes a surface irregularity.

Find Patent Forward Citations

Loading…