The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2020

Filed:

Jul. 06, 2017
Applicant:

The Boeing Company, Chicago, IL (US);

Inventor:

Eric Rehder, Los Angeles, CA (US);

Assignee:

THE BOEING COMPANY, Chicago, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 7/00 (2006.01); H01L 31/042 (2014.01); H01L 31/0224 (2006.01); H01L 31/05 (2014.01); H01L 27/142 (2014.01); H01L 31/0443 (2014.01); H01L 31/044 (2014.01); H01L 31/02 (2006.01); H01L 31/0352 (2006.01); H02S 40/34 (2014.01); H01L 21/02 (2006.01); H01L 31/0392 (2006.01); H01L 31/0687 (2012.01); H01L 31/048 (2014.01);
U.S. Cl.
CPC ...
H01L 31/042 (2013.01); H01L 21/02439 (2013.01); H01L 27/142 (2013.01); H01L 31/02 (2013.01); H01L 31/02008 (2013.01); H01L 31/02021 (2013.01); H01L 31/022425 (2013.01); H01L 31/0392 (2013.01); H01L 31/03529 (2013.01); H01L 31/035227 (2013.01); H01L 31/035281 (2013.01); H01L 31/044 (2014.12); H01L 31/048 (2013.01); H01L 31/0443 (2014.12); H01L 31/05 (2013.01); H01L 31/0504 (2013.01); H01L 31/0508 (2013.01); H01L 31/0516 (2013.01); H01L 31/0687 (2013.01); H02S 40/34 (2014.12); Y02E 10/544 (2013.01);
Abstract

An electrical connection is formed between first and second conductive elements, by inserting a nano-metal material between the first and second conductive elements; and heating the nano-metal material to a melting temperature to form the electrical connection between the first and second conductive elements. The nano-metal material may comprise a nano-metal paste or ink comprised of one or more of Gold (Au), Copper (Cu), Silver (Ag), and/or Aluminum (Al) nano-particles that melt or fuse into a solid to form the electrical connection, at a melting temperature of about 150-250 degrees C., and more preferably, about 175-225 degrees C. The electrical connection may be formed between a solar cell and a substrate by creating a via in the solar cell between a front and back side of the solar cell, wherein the via is connected to a contact on the front side of the solar cell and a trace on the substrate.


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