The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2020

Filed:

Sep. 02, 2015
Applicants:

John S. Frost, Oak Park, CA (US);

Randolph J. Brandt, Palmdale, CA (US);

Peter Hebert, Glendale, CA (US);

Omar AL Taher, Los Angeles, CA (US);

Inventors:

John S. Frost, Oak Park, CA (US);

Randolph J. Brandt, Palmdale, CA (US);

Peter Hebert, Glendale, CA (US);

Omar Al Taher, Los Angeles, CA (US);

Assignee:

THE BOEING COMPANY, Chicago, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 31/02 (2006.01); H05K 1/02 (2006.01); H05K 3/40 (2006.01); H01R 43/02 (2006.01);
U.S. Cl.
CPC ...
H01L 31/02008 (2013.01); H01R 43/02 (2013.01);
Abstract

A method including forming an interconnect in a metal member. The interconnect includes multiple repeating, nested V-shaped structures forming a continuous central portion. A vertex of each of the multiple repeating, nested V-shaped structures adjoins a next vertex of a next V-shaped structure of the multiple repeating, nested V-shaped structures. The method further includes separating the interconnect from the metal member.


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