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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10763245 B1

PDFFull Text
Date of Patent:
Sep. 01, 2020

Filed:

Sep. 29, 2017

Optoelectronic component with a first potting material covering parts of a first optoelectronic semiconductor chip and a second potting material covering the first potting material

Applicant:

Osram Oled Gmbh, Regensburg, DE;

Inventors:

Luca Haiberger, Regensburg, DE;

Matthias Sperl, Mintraching, DE;

Assignee:

OSRAM OLED GmbH, Regensburg, DE;

Attorney:

DLA Piper LLP (US)

Primary Examiner:

David Chen

Int. Cl.
CPC ...
H01L 25/075 (2006.01); H01L 23/31 (2006.01); H01L 33/58 (2010.01); H01L 23/00 (2006.01); H01L 33/54 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H01L 33/52 (2010.01); H01L 33/30 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 23/3135 (2013.01); H01L 24/73 (2013.01); H01L 33/54 (2013.01); H01L 33/58 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 24/48 (2013.01); H01L 33/30 (2013.01); H01L 33/52 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/181 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0058 (2013.01);
Abstract

An optoelectronic component includes a carrier, wherein a first optoelectronic semiconductor chip and a second optoelectronic semiconductor chip are arranged above a top side of the carrier, the optoelectronic semiconductor chips each include a top side, an underside situated opposite the top side, and side faces extending between the top side and the underside, the undersides of the optoelectronic semiconductor chips face the top side of the carrier, a first potting material is arranged above the top side of the carrier, the first potting material covering parts of the side faces of the first optoelectronic semiconductor chip, and a second potting material is arranged above the top side of the carrier, and the second potting material covering the first potting material.

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